Non-contact cutting process to eliminate stress to the PCB and its delicate components
Reduced micro-cracks and reduced delamination for longer PCB life
Greater flexibility to cut unusual shapes
Faster set up for smaller production batches
More consistent laser accuracy over the life of the tool
Narrower cuts and less dust generated during the laser singulation process
Fewer burrs

Laser Depaneling Machine Specification:

Laser	Q-Switched diode-pumped all solid-state UV laser
Laser Wavelength	355nm
Laser Power	10W/12W/15W/18W@30KHz
Positioning Precision of Worktable of Linear Motor	±2μm
Repetition Precision of Worktable of Linear Motor	±1μm
Effective Working Field	400mmX300mm(Customizable)
Laser Scanning Speed	2500mm/s (max)
Galvanometer Working Field Per One Process	40mmх40mm

Laser Depaneling Machine Application:

FPC and some relative materials;

FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting;

Laser Depaneling Machine CE approval

More information welcome to contact us:

Email: sales@dgwill.com

Wechat/Whatsapp(Bunny): +86 13684904990

Product Tags:

laser pcb depaneling machine

808nm diode laser machine

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