Shenzhen SMTfly Electronic Equipment Manufactory Limited
SMTfly help you soar!
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| Model | DurostoneCHP760 | DurostoneCAS761 | DurostoneCAG762 |
| Grade | Standard | Anti-Static | Anti-static(Optical) |
| Colour | Blue | Black | Grey |
| Density(g/mm3) | 1.85 | 1.85 | 1.85 |
| Standard OperationTemperature | 260 | 260 | 260 |
| Maximum Operation Temperature(C) | 350 | 350 | 350 |
| Sheet Size(mm) | 2440×1220 | 2440×1220 | 2440×1220 |
| Thickness/weight(mm/kg) | 3/17, 4/22 | 5/28, 6/33, 8/44 | 10/55, 12/66 |
Used by most of our customers because of some advantages:
1. Faster positioning on the production line
2. Low costs due to the missing of reinforced bars
3. Better volume stocking
4. Better yield with different board type on the production line
Surface-mount technology (SMT) is the leading factor driving higher circuit densities per square inch on PCBs. Directly attaching components and devices to the surface of circuit boards has enabled products to perform with much higher circuit speeds, allowed greater circuit density, and requires fewer external connections. These advances have greatly lowered costs, improved performance and product reliability. However, these benefits do not come without their challenges. Printing solder paste on diminishing pad sizes, placing smaller components, and reflowing entire assemblies with their varieties of termination finishes and materials are just a few of the technical challenges that process engineers face every day.
This estimation may be done in three ways
If a PCB is available (preferably populated) - our sales engineers can rapidly evaluate your board.
If PCB design data is available we will process, analyze, and remotely assess it.
You can do it using the rules presented below - our customers quickly find that the above two methods are easiest.
Gerber, Excellon, and other data required
Pin Land to SMT pad clearance evaluation
The two figures below each show part of a CSWSC in plan and section views. The right-hand figure shows that more clearance
is required when the connector orientation is perpendicular to the wave.
PTH Components Located Parallel to the direction through wave
The clearance required between the pin land and SMT pad can be made quite
small, as the solder does not have to flow "under" the component pockets.
PCB Design Implications - for Board Designers - or respin
We are often called upon by our customers to help with identifying design respin opportunities.
We will identify problem areas within a board and suggest appropriate movements of components. (Ideally, before the PCB is fabricated)
However, for board designers reading this, can you remember another four "rules" (to compete with the hundred other rules you have to have floating
around in your head).
Keep large (height) SMT components away from PTH areas.
Leave the leading and trailing areas around PTH components as clear as possible.
DON'T put any SMT components within 3mm (0.12") of any PTH components.
DON'T put all PTH components in line along one edge of a board - leave some space to allow us to support the masking in the center of the board.