Shenzhen SMTfly Electronic Equipment Manufactory Limited
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±20 μm Precision FPC Laser Cutting Machine For PCB Board Manufacturing Process FPC Laser Cutting Machine Parameter
| Parameter | ||
|
Technical parameters | Main body of laser | 1480mm*1360mm*1412 mm |
| Weight of machine | 1500Kg | |
| Power | AC220 V | |
| Laser | 355 nm | |
| Laser | Optowave 10-20W(US) | |
| Material | ≤1.2 mm | |
| Precision | ±20 μm | |
| Positioning | ±2 μm | |
| Platform | ±2 μm | |
| Working area | 450*430 mm | |
| Maximum | 3 KW | |
| Vibrating | CTI(US) | |
| Power | AC220 V | |
| Diameter | 20±5 μm | |
| Ambient | 20±2 ℃ | |
| Ambient | ＜60 % | |
| The Machine | Marble | |
FPC Laser Cutting Machine Features:
1. Neat and smooth edge, no burr or overflow
2. More quick and easy, shorten the delivery time
3. High quality ,no distortion,surface clean& uniformity;
4. Gathering the CNC tech,laser tech,software tech…High accuracy, High speed.
FPC Laser Cutting Machine Advantages:
FPC Laser Cutting Machine Application:
FPC and some relative materials;
FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting.
